@inproceedings{jo_wafer-level_2022,
	title = {Wafer-level hermetically sealed silicon photonic {MEMS} by Direct Metal-to\_Metal Bonding},
	abstract = {The field of silicon (Si) photonic micro-electromechanical system ({MEMS}) for photonic
integrated circuits ({PICs}) has evolved rapidly. Thanks to the ultra-low power consumption of
Si photonic {MEMS}, it enables a wide range of high-performance photonic devices such as
integrated optical {MEMS} phase shifters, tunable couplers and switches. However, photonic
{MEMS} have suspended and movable parts which need to be protected from environmental
influences, such as exposure to dust and humidity. Therefore, a packaging solution is needed
for reliable operation over long periods. Here, we demonstrate wafer-level vacuum sealing of
Si photonic {MEMS} inside cavities with ultra-thin Si caps.},
	eventtitle = {{WaferBond}'22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration},
	booktitle = {{WaferBond}'22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration},
	author = {Jo, Gaehun and Edinger, Pierre and Bleiker, Simon J. and Wang, Xiaojing and Yuji Takabayashi, Alain},
	date = {2022-11-30},
}