%0 Conference Paper
%T Wafer-level hermetically sealed silicon photonic MEMS by Direct Metal-to_Metal Bonding
%W http://kth.diva-portal.org/smash/record.jsf?pid=diva2%3A1714873&dswid=-9036
%X The field of silicon (Si) photonic micro-electromechanical system (MEMS) for photonic
integrated circuits (PICs) has evolved rapidly. Thanks to the ultra-low power consumption of
Si photonic MEMS, it enables a wide range of high-performance photonic devices such as
integrated optical MEMS phase shifters, tunable couplers and switches. However, photonic
MEMS have suspended and movable parts which need to be protected from environmental
influences, such as exposure to dust and humidity. Therefore, a packaging solution is needed
for reliable operation over long periods. Here, we demonstrate wafer-level vacuum sealing of
Si photonic MEMS inside cavities with ultra-thin Si caps.
%B WaferBond'22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration
%A Jo, Gaehun
%A Edinger, Pierre
%A Bleiker, Simon J.
%A Wang, Xiaojing
%A Yuji Takabayashi, Alain
%D 2022-11-30