A scalable method for the large-area integration of 2D materials

ULISSES project played a big role in the discovering of a new technique for integrating 2D materials into semiconductors, a revolutionary technique, with huge potential for providing devices with much smaller size and extended functionalities with respect to what can be achieved with today’s silicon technologies.

An article featuring ULISSES researchers , Arne Quellmalz (KTH), Maximilian Prechtl, Georg Duesberg (UNIBW), Max Lemme (AMO), Kristinn Gylfason, and Franz Niklaus (KTH) has been published on Nature Communications.

Read more on our dedicated page.

This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 825272 (ULISSES).