New conference paper just released by KTH

The KTH team was represented by PhD student Gaehun Jo, at the International Conference on Wafer Bonding – WaferBond’22 held in October 2022.

The conference paper is available in open access. It describes a new process developed to achieve wafer-level hermetic sealing of silicon (Si) photonic micro-electromechanical system (MEMS) inside cavities with ultra-thin Si caps. This novel packaging solution, which has been developed in synergies with other EU-funded projects, is a promising and versatile approach for novel integrated MEMS applications, such as integrated optical MEMS phase shifters, tunable couplers and switches.

This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 825272 (ULISSES).