The KTH team was represented by PhD student Gaehun Jo, at the International Conference on Wafer Bonding – WaferBond’22 held in October 2022.
The conference paper is available in open access. It describes a new process developed to achieve wafer-level hermetic sealing of silicon (Si) photonic micro-electromechanical system (MEMS) inside cavities with ultra-thin Si caps. This novel packaging solution, which has been developed in synergies with other EU-funded projects, is a promising and versatile approach for novel integrated MEMS applications, such as integrated optical MEMS phase shifters, tunable couplers and switches.