The KTH team was represented by PhD student Gaehun Jo, at the International Conference on Wafer Bonding – WaferBond’22 held in October 2022.
The conference paper is available in open access. It describes a new process developed to achieve wafer-level hermetic sealing of silicon (Si) photonic micro-electromechanical system (MEMS) inside cavities with ultra-thin Si caps. This novel packaging solution, which has been developed in synergies with other EU-funded projects, is a promising and versatile approach for novel integrated MEMS applications, such as integrated optical MEMS phase shifters, tunable couplers and switches.
The event, sponsored by ULISSES, is organised by AMO GmbH on November 21-22, 2022 in Aachen, bringing together experts from academia and industry to discuss recent advances on the integration of novel materials into silicon photonic platforms.
Our 9th consortium meeting, a two days event, is hosted this week by our partner Graphenea in San Sebastian. Very fruitful exchanges and collaborative work during this event where nearly all participants joined in-person.