New conference paper just released by KTH

The KTH team was represented by PhD student Gaehun Jo, at the International Conference on Wafer Bonding – WaferBond’22 held in October 2022.

The conference paper is available in open access. It describes a new process developed to achieve wafer-level hermetic sealing of silicon (Si) photonic micro-electromechanical system (MEMS) inside cavities with ultra-thin Si caps. This novel packaging solution, which has been developed in synergies with other EU-funded projects, is a promising and versatile approach for novel integrated MEMS applications, such as integrated optical MEMS phase shifters, tunable couplers and switches.

Free-for-all workshop on "Integration of novel materials into silicon photonics"

The event, sponsored by ULISSES, is organised by AMO GmbH on November 21-22, 2022 in Aachen, bringing together experts from academia and industry to discuss recent advances on the integration of novel materials into silicon photonic platforms.

Registration form.

Publication in IEEE on Efficient time-adaptive Expectation Maximization algorithm for HMM tracking

Congrats to the KTH team for their publication in IEEE Transactions on Industrial Informatics "Time-Adaptive Expectation Maximization Learning Framework for HMM Based Data-Driven Gas Sensor Calibration". Check our Research highlights to learn more about it.

Learn more about ULISSES with our Outcomes page

From research highlights to our latest conference contributions and video, you'll find major update on our "Outcomes" page, check it out!

ULISSES CM9 in San Sebatian

Our 9th consortium meeting, a two days event, is hosted this week by our partner Graphenea in San Sebastian. Very fruitful exchanges and collaborative work during this event where nearly all participants joined in-person.

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This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 825272 (ULISSES).